| Trident has adopted a "fabless" manufacturing
strategy whereby we contract-out our wafer fabricating
needs to qualified contractors who we believe provide
cost, technology, or capacity advantages for specific
products. As a result, Trident has avoided making the
significant capital investments required for wafer fabrication
facilities, while focusing resources on product design,
quality assurance, marketing, and customer support.
In fiscal 2002, Trident's primary foundry is United
Microelectronics Corporation (UMC) and primary packaging
and testing house is Siliconware Precision Industries
Company Ltd. (SPIL). Trident purchases product in wafer
form from the foundry and manages the contracting with
third parties for the chip packaging and testing. In
order to manage the production back-end operations,
we have added personnel and equipment to this area.
Trident's goal is to increase product quality, while
reducing manufacturing cost. To ensure the integrity
of the suppliers' quality assurance procedures, we develop
and maintain test tools, detailed test procedures, and
test specifications for each product. We also require
the foundry and third party contractors to use those
procedures and specifications before shipping finished
products.
Trident's goal is to increase product quality, while
reducing manufacturing cost. To ensure the integrity
of the suppliers' quality assurance procedures, we develop
and maintain test tools, detailed test procedures, and
test specifications for each product. We also require
the foundry and third party contractors to use those
procedures and specifications before shipping finished
products. |
